LinkZill has completed a Pre-A round of financing led by Zhenfund and followed by Super Gravity Capital. This round of financing will be mainly used for TFT module lab construction, product development and volume release, market investment, and company operation.

LinkZill CEO Dr. Feng said that the chip product types have covered mainstream TFT systems, such as amorphous silicon a-Si, oxide IGZO, low-temperature polysilicon LTPS, and organic semiconductor OTFT. The application areas cover high throughput DNA synthesis, active digital microfluidics, high throughput biochemical (including new crown), photo-sensing, etc. The TFT-based active digital microfluidic chip is in the pilot stage, and the TFT-based DNA synthesis and biochemical sensing chip are in the prototype validation stage.

Dr. Feng also conveys, China is expected to be the first to upgrade the TFT semiconductor industry and lead the trillion-dollar panel manufacturing industry to complete the conversion from IDM to IDM + Foundry/Fabless model. On the competitive advantage, LinkZill has accumulated three-dimensional technology capability from chip process, simulation, and design to system integration, and mastered cross-field TFT chip IP design, cutting-edge functional materials, product integration, and other core industrialization capabilities. This cross-field capability forms the company’s barrier.