LinkZill co-authored IEDM and IEEE EDL papers with Prof. Xiaojun Guo's group from Shanghai Jiao Tong

IEDM 2019 has been held in San Francisco from December 7th to 11th, 2019. LinkZill cooperated with Prof. Xiaojun Guo of Shanghai Jiao Tong University. A paper entitled "Solution Processed Highly Uniform and Reliable Low Voltage Organic FETs and Facile Packaging for Handheld Multi-ion Sensing" was published on IEDM this year. The main research covered in this paper is that the low power field effect transistor fabricated on 10 cm × 10 cm size substrate by solution method has excellent uniformity (threshold voltage spread of 200 mV for more than 100 measured devices). A blend solution of small molecule organic semiconductor and polymer binder was deposited via a soft contact coating technique at a fast speed (20 mm/s) on photolith patterned fine resolution electrodes. With well controlled contact induced crystallization, highly uniform crystalline channels were obtained with low sub-gap density of states over large area for low voltage electrical behaviors (subthreshold swing of 80 mV/decade) and excellent uniformity. The devices also exhibit superior bias stress stability in all operational regimes. A facile packaging approach was further developed to connect the OFET electrodes to external wet test environment. Finally, a handheld battery powered multi-ion (H+, Na+, K+) sensing system was demonstrated for point-of-care test.

Mr. Yukun Huang (Ph.D. candidate) from Shanghai Jiao Tong University gave a presentation at IEDM 2019

IEDM (International Electron Devices Meeting) is the flagship conference in the field of microelectronic devices organized by the Institute of Electrical and Electronic Engineers (IEEE). It has a history of more than 60 years. The conference is dedicated to reporting on technological breakthroughs in semiconductor and electronic equipment technology, design, manufacturing, physics and modeling, and enjoys a high academic status and broad influence in the international semiconductor technology community.

In early of 2020, two parties co-authored a paper in IEEE Electron Device Letters, a top SCI journal in the area of semiconductor devices. Click to see details of " Facile Four-Mask Processes for Organic Thin-Film Transistor Integration Structure With Metal Interconnect" paper published in IEEE EDL.